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Features:
• Improve the installation efficiency of Housing and Wafer through Outer Lock mode.
• Set 2 grooves on both sides of the Housing lock to prevent reverse insertion of Wafer.
• Two types of terminals (#22 to #24) (#24 to #30) are used, which are suitable for most wire sizes.
• The surface of Wafer Pin adopts Tin Re-flow Treatment to meet lead-free requirements. Wafers that conform to SMT are available.
Specification:
Number of poles : 2 ~ 16P
Pole spacing : 2.0mm
Rated voltage: AC.DC250V
Rated current: 3A
Withstand voltage: AC1000V/1min
Insulation resistance: 1000MΩ or more
Operating temperature range: -40 ~+85 ℃
Corresponding PCB thickness: 0.8 ~ 1.6mm
Corresponding PCB hole diameter: Ø0.8mm
Wire Size : #22 ~ #30
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